Telecom high layer PCB
  • Specification

    Layer count: 40
    Board thickness:3.0mm
    Dimension:158*83.21mm
    Raw material:FR4 TG170 tuc
    Copper thickness on the board surface:140um
    Copper thickness in the hole barrel:50um
    Min.line width/space:0.30mm
    Minimum hole diameter:0.4mm
    Surface finishing:immersion gold≥1u"
    Application:telecom power supply