Telecom hybrid material PCB
  • Specification

    Layer count:4
    Board thickness:1.6mm
    Dimension:118*57.5mm
    Raw material:PTFE+FR4
    Copper thickness on the board surface:56um
    Copper thickness in the hole barrel:25um
    Min.line width/space:0.20mm
    Minimum hole diameter:0.25mm
    Surface finishing:immersion gold≥1u"
    Application:Communication